Magnetic sputtering high -purity (Y) is a commonly used surface treatment technology to improve the performance and function of the material.

1. The principle of magnetic control sputtering high purity: Magnetic sputtering is a technology that uses magnetic fields to control ion bombardment materials and deposit on the base. In the process of magnetic control sputtering, first use the metal or compounds as a target, in the vacuum or inert gas environment, generate a pupa ion by heating the target, and then use the magnetic field to guide the ions to deposit on the base surface to be treated to achieve the plating layer of the plating layer. form.

2. Features of high -purity 钇 plating layer: Because 钇 has good electrical and chemical properties, the high -purity coating has the following characteristics: First, it has good electrical conductivity, which can improve the electrical performance of the material; Good properties, have strong corrosion resistance, can improve the corrosion resistance of materials; third, have excellent magnetic properties and can provide magnetic field response capabilities in some magnetic materials.

3. Application field of high -purity coating: Magnetic sputtering is widely used in various fields, such as electronic devices, optical film, magnetic materials, etc. In electronic devices, it can be used to prepare electrode materials, conductive adhesives, and packaging layers of microelectronics. In terms of optical film, high -purity coating can be used to prepare anti -reflective membranes, filter membranes and reflex membranes. In terms of magnetic materials, high -purity coating can be used to prepare the surface treatment of various magnetic materials, such as magnetic sensors, magnetic recording materials, etc.

4. The technical point of preparing the high -purity coating: The following technical points are required to prepare high -purity plating layers: First, to ensure the purity and purity of the target, because the purity of the plating layer directly affects the performance of the plating layer; the second is to optimize splash splash spatter The radiation conditions, including the heating temperature of the target, the flow of the sputtering gas, and the ion bombardment energy; the third is to control the sedimentary rate and thickness, and control the thickness and uniformity of the coating by adjusting the sedimentary time and the rotation speed of the base.

In short, Magnetic Splash Plating Gallad Plating is a commonly used surface treatment technology and has a wide range of applications. By understanding and mastering related preparation technical points, you can better apply this technology and improve the performance and function of materials.